JEDEC（JEDEC Solid State Technology Association）成立于1960年。作为全球固态半导体行业标准的领先开发组织，JEDEC 由275家成员公司推选的大约1800名代表组成，下设50个JEDEC委员会，以此满足本行业的各方面需求和制造商以及消费者的需求。JEDEC 是电子工业联合会（EIA）的成员，其发布的标准和出版物得到了全球的普遍认可。
CESI（China Electronics Standardization Institute）中国电子技术标准化研究所一直致力于电子行业的标准化、国际化方面的工作。JEDEC授权CESI为中国出版、发行JEDEC标准中文版的机构。为此，CESI标准化工作组，负责组织和协调有关标准的选定、翻译、审核、培训及其他相关事务。希望此次翻译出版的JEDEC的7本标准的中文版将为中国集成电路业界标准化、国际化工作起到积极的促进作用。
标准编号
标准名称
JESD79-2
最新版：JESD79-2C
May-2006
DDR2 SDRAM 规范
DDR2 SDRAM SPECIFICATION
This comprehensive standard defines all required aspects of 256Mb through 4Gb DDR2 SDRAMs with x4/x8/x16 data interfaces, including pinout, addressing, functional description, features, ac and dc parametrics, truth tables, and packages. Standard JESD79-2 uses a SSTL_18 interface, which is described in another JEDEC standard called JESD8-15. The purpose of this Standard is to define the minimum set of requirements for compliant devices 256Mb through 4Gb, x4/x8/x16 DDR2 SDRAMs. System designs based on the required aspects of this specification will be supported by all DDR2 SDRAM vendors providing compliant devices.
该标准定义了拥有x4/x8/x16数据接口的256Mb 到4Gb DDR2 SDRAMS的所有要求，包括引出端、地址、功能描述、特征、AC和DC参数、真值表和封装。标准的JESD79-2利用SSTL_18接口，这在JEDEC的另一个标准文件JESD8-15中介绍。本标准的目的是定义x4/x8/x16数据接口的256Mb 到4Gb DDR2 SDRAMS的最低要求。基于本规范要求的系统设计会得到提供适用器件的DDR2 SDRAM供应商的支持。
JESD79D
最新版：JESD79E
May-2005
双倍数据数列（DDR）SDRAM 规范
DOUBLE DATA RATE(DDR) SDRAM SPECIFICATION
This comprehensive standard defines all required aspects of 64Mb through 1Gb DDR SDRAMs with X4/X8/X16 data interfaces, including features, functionality, ac and dc parametrics, packages and pin assignments. This scope will subsequently be expanded to formally apply to x32 devices, and higher density devices as well. The purpose of this Standard is to define the minimum set of requirements for JEDEC compliant 64Mb through 1Gb, X4/X8/X16 DDR SDRAMs. System designs based on the required aspects of this specification will be supported by all DDR SDRAM vendors providing JEDEC compliant devices.
该标准定义了拥有x4/x8/x16数据接口的64Mb 到1Gb DDR SDRAMS的所有要求，包括引出端、地址、功能描述、特征、AC和DC参数、真值表和封装。这个范围将被正式扩展到x32器件和更高集成度的器件。本标准的目的是定义x4/x8/x16数据接口的64Mb 到1Gb DDR SDRAMS的最低要求。基于本规范要求的系统设计会得到提供适用器件的DDR SDRAM供应商的支持。
JESD97
识别无铅组件、元件和器件的记号、符号和标志
Marking, Symbols, and Labels for Identification of Lead (Pb) Free Assemblies, Components, and Devices
JESD22-B102D
最新版：JESD22-B102D
Sep-2004
可焊性
SOLDERABILITY
This test method provides optional conditions for preconditioning and soldering for the purpose of assessing the solderability of device package terminations. It provides procedures for dip & look solderability testing of through hole, axial and surface mount devices and a surface mount process simulation test for surface mount packages. The purpose of this test method is to provide a means of determining the solderability of device package terminations that are intended to be joined to another surface using lead (Pb) containing or Pb-free solder for the attachment.
本试验方法提供可选择的预处理条件和评估器件引出端可焊性的方法。本方法提供DIP、通孔轴向和表面安装器件可焊性试验以及表面安装的程序模拟。本试验方法的目的是提供器件的引出端可焊性评估方法，用于判定其焊接到其他含Pb或无铅物表面的能力。
J-STD-020C
最新版：J-STD-020D
Jun-2007
对于非密封固态表面安装器件的水汽/回流敏感度分类
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress. It is used to determine what classification level should be used for initial reliability qualification. Once identified, the SMDs can be properly packaged, stored and handled to avoid subsequent thermal and mechanical damage during the assembly solder reflow attachment and/or repair operation.
本标准用于确定非气密封装的表面安装器件（SMD）的湿气敏感度等级。它用于确定何种等级应进行初始可靠性鉴定。一旦被确认，SMD可被适当的包装、贮存和处理已避免在组装过程中的回流和/或返修中的热和机械损伤。
J-STD-033A
最新版：J-STD-033B.1
Jan-2007
湿气/回流敏感表面安装器件的操作、包装、运输和使用
Handling, Packing,Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
This document provides SMD manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive SMDs.
本标准提供SMD生产商和使用者对湿气/回流敏感表面安装器件的操作、包装、运输和使用的标准方法。
JESD22-A113D
最新版：JESD22-A113E
Mar-2006
非气密表面安装器件可靠性试验前的预处理
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
This Test Method establishes an industry standard preconditioning flow for nonhermetic solid state SMDs (surface mount devices) that is representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence of this document by the semiconductor manufacturer prior to being submitted to specific in-house reliability testing (qualification and reliability monitoring) to evaluate long term reliability (which might be impacted by solder reflow).
本试验方法提供的是工业标准用于非气密封装的SMD预处理流程，具有典型的工业回流流程。在生产商进行可靠性试验前（鉴定和可靠性监控），SMD应按本标准适当的预处理顺序进行，以评估长期可靠性（可能和载流焊冲突）。